S10604-200CT_15 Datasheet, PDF (5/7 Pages) Hamamatsu Corporation – Photo IC diode

Photo IC diode
S10604-200CT
Packing specifications
Tape (3000 pcs./reel)
ϕ1.5
2
4
Cathode
Anode
0.23
KPICA0073EA
Reel
ɸ13
2.2
Recommended temperature profile of reflow soldering
300
Peak temperature 260 °C max.
250
200
Heating
time
(217 °C min.)
150
Preheating time
100 s
(150 to 200 °C)
160 s
100
50
0
0 50 100 150 200 250 300 350 400
Time (s)
KPICB0119EA
9
10
KPICA0074EA
· After unpacking, store this device in an environment at a temperature of 5 to 25 °C and a humidity below 60%, and perform reflow
soldering on this device within 168 hours (7 days).
· Thermal stress applied to the device during reflow soldering differs depending on the PC boards and reflow oven being used. When
setting the reflow conditions, make sure that the reflow soldering process does not degrade device reliability.
5