S11865-64_15 Datasheet, PDF (12/14 Pages) Hamamatsu Corporation – Photodiode arrays combined with signal processing IC

Photodiode arrays with amplifiers
S11865-64/-128/-256, S11866-64-02/-128-02
Readout circuit
Check that pulse signals meet the required pulse conditions before supplying them to the input terminals.
Video output should be amplified by an operational amplifier that is connected close to the sensor.
Precantions
(1) The signal processing IC chip is protected against static electricity. However, in order to prevent possible damage to the IC chip,
take electrostatic countermeasures such as grounding yourself, as well as workbench and tools. Also protect the IC chip from surge
voltages from peripheral equipment.
(2) Gold wires for wire bonding are very thin, so they easily break if subjected to mechanical stress. The signal processing IC chip and
wire bonding section are covered with resin for protection. However, never touch these portions. Excessive force, if applied, may
break the wires or cause malfunction.
Blow air to remove dust or debris if it gets on the protective resin. Never wash them with solvent.
Signals may not be obtained if dust or debris is left or a scratch is made on the protective resin, or the signal processing IC chip or
photodiode array chip is nicked.
(3) The photodiode array characteristics may deteriorate when operated at high humidity, so put it in a hermetically sealed enclosure or case.
When installing the photodiode array on a board, be careful not to cause the board to warp.
Related information
www.hamamatsu.com/sp/ssd/doc_en.html
Precautions
∙ Notice
∙ Image sensors/Precautions
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