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GS816118BT Datasheet, PDF (32/35 Pages) GSI Technology – 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs | |||
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GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
TQFP Package Drawing (Package T)
Symbol Description Min. Nom. Max
θ
L
L1
c
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09 â 0.20
D Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
â 0.65 â
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
â 1.00 â
A1
Y
Coplanarity
0.10
A2
E1
θ
Lead Angle
0° â 7°
E
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 1.03 9/2005
32/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
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