GS816273C Datasheet, PDF (23/25 Pages) GSI Technology – 256K x 72 18Mb S/DCD Sync Burst SRAMs

209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
A
aaa
D
D1
e
GS816273C-250/225
C A1
Side View
Bottom View
∅b
e
Symbol
Min
Typ
A
—
—
A1
0.40
0.50
∅b
0.50
0.60
c
0.31
0.36
D
21.9
22.0
Rev 1.0
Package Dimensions—119-Pin PBGA
Package
209 BGA (C)
Max Units Symbol
1.70
mm
D1
0.60
mm
E
0.70
mm
E1
0.38
mm
e
22.1
mm
aaa
Min
Typ
Max
—
18.0 (BSC)
—
13.9
14.0
14.1
—
10.0 (BSC)
—
—
1.00 (BSC)
—
—
0.15
—
Units
mm
mm
mm
mm
mm
Thermal Characteristics
Junction to Ambient (θ)
(°C/W)
0 m/s
1 m/s
2 m/s
17.7
16.0
14.1
Junction to Case (θ)
(°C/W)
2.8
Rev: 1.03 7/2004
23/25
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology