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GA04JT17-247 Datasheet, PDF (8/12 Pages) GeneSiC Semiconductor, Inc. – Normally – OFF Silicon Carbide Junction Transistor
GA04JT17-247
Ideally, IG,pon should terminate when the drain voltage falls to its on-state value in order to avoid unnecessary drive losses during the steady
on-state. In practice, the rise time of the IG,on pulse is affected by the parasitic inductances, Lpar in the device package and drive circuit. A
voltage developed across the parasitic inductance in the source path, Ls, can de-bias the gate-source junction, when high drain currents begin
to flow through the device. The voltage applied to the gate pin should be maintained high enough, above the VGS,sat (see Figure 7) level to
counter these effects.
A high negative peak current, -IG,off is recommended at the start of the turn-off transition, in order to rapidly sweep out the injected carriers from
the gate, and achieve rapid turn-off. While satisfactory turn off can be achieved with VGS = 0 V, a negative gate voltage VGS may be used in
order to speed up the turn-off transition.
Two high-speed drive topologies for the SiC SJTs are presented below.
B:1: High Speed, Low Loss Drive with Boost Capacitor, GA03IDDJT30-FR4
The GA04JT17-247 may be driven using a High Speed, Low Loss Drive with Boost Capacitor topology in which multiple voltage levels, a gate
resistor, and a gate capacitor are used to provide fast switching current peaks at turn-on and turn-off and a continuous gate current while in
on-state. A 3 kV isolated evaluation gate drive board (GA03IDDJT30-FR4) utilizing this topology is commercially available for high and low-
side driving, its datasheet provides additional details about this drive topology.
Figure 24: Topology of the GA03IDDJT30-FR4 Two Voltage Source gate driver.
The GA03IDDJT30-FR4 evaluation board comes equipped with two on board gate drive resistors (RG1, RG2) pre-installed for an effective
gate resistance3 of RG = 3.75 Ω. It may be necessary for the user to reduce RG1 and RG2 under high drain current conditions for safe
operation of the GA04JT17-247. The steady state current supplied to the gate pin of the GA04JT17-247 with on-board RG = 3.75 Ω, is shown
in Figure 25. The maximum allowable safe value of RG for the user’s required drain current can be read from Figure 26.
For the GA04JT17-247, RG must be reduced for ID ≥ ~8 A for safe operation with the GA03IDDJT30-FR4.
For operation at ID ≥ ~8 A, RG may be calculated from the following equation, which contains the DC current gain hFE (Figure 6) and the gate-
source saturation voltage VGS,sat (Figure 7).
,
4.7
,
1.5
,
0.6Ω
Nov 2014
http://www.genesicsemi.com/commercial-sic/sic-junction-transistors/
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