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MB82DP04183C Datasheet, PDF (32/33 Pages) Fujitsu Component Limited. – 64M Bit (4 M word × 16 bit) Mobile Phone Application Specific Memory | |||
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MB82DP04183C-65L
⢠Package Dimension
71-ball plastic FBGA
(BGA-71P-M03)
71-ball plastic FBGA
(BGA-71P-M03)
Ball pitch
Package width Ã
package length
Lead shape
Sealing method
Ball size
Mounting height
Weight
0.80 mm
7.00 Ã 11.00 mm
Soldering ball
Plastic mold
â
0.45 mm
1.20 mm Max.
0.14 g
11.00±0.10(.433±.004)
INDEX-MARK AREA
0.20(.008) S B
1.09
+0.11
â0.10
.043
+.004
â.004
(Seated height)
0.80(.031)
REF
A
7.00±0.10
(.276±.004)
0.40(.016)
REF
0.10(.004) S
B
0.40(.016)
REF
0.80(.031)
REF
8
7
6
5
4
3
2
1
0.39±0.10
(.015±.004)
(Stand
off)
ML K J HGF EDCBA
S
0.20(.008) S A
71-ø0.45
+0.10
â0.05
71-ø.018
+.004
â.002
ø0.08(.003) M S AB
0.10(.004) S
C 2003 FUJITSU LIMITED B71003S-c-1-1
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
32
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