MB82DP04184E-65L Datasheet, PDF (30/31 Pages) Fujitsu Component Limited. – 64M Bit (4 M word × 16 bit) Mobile Phone Application Specific Memory

MB82DP04184E-65L
■ PACKAGE DIMENSION
71-ball plastic FBGA
(BGA-71P-M03)
71-ball plastic FBGA
(BGA-71P-M03)
Ball pitch
Package width ×
package length
Lead shape
Sealing method
Ball size
Mounting height
Weight
0.80 mm
7.00 × 11.00 mm
Soldering ball
Plastic mold
∅0.45 mm
1.20 mm Max.
0.14 g
11.00±0.10(.433±.004)
INDEX-MARK AREA
0.20(.008) S B
1.09
+0.11
–0.10
.043
+.004
–.004
(Seated height)
0.80(.031)
REF
A
7.00±0.10
(.276±.004)
0.40(.016)
REF
0.10(.004) S
B
0.40(.016)
REF
0.80(.031)
REF
8
7
6
5
4
3
2
1
0.39±0.10
(.015±.004)
(Stand
off)
ML K J HGF EDCBA
S
0.20(.008) S A
71-ø0.45
+0.10
–0.05
71-ø.018
+.004
–.002
ø0.08(.003) M S AB
0.10(.004) S
C _{2003 FUJITSU LIMITED B71003S-c-1-1}
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
30