MB85RS256_09 Datasheet, PDF (18/20 Pages) Fujitsu Component Limited. – Memory FRAM CMOS 256 K (32 K × 8) Bit SPI

MB85RS256
■ PACKAGE DIMENSION
8-pin plastic SOP
(FPT-8P-M02)
8-pin plastic SOP
(FPT-8P-M02)
*¹
5.05
+0.25
–0.20
.199
+.010
–.008
8
5
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
1.27 mm
3.9 × 5.05 mm
Gullwing
Plastic mold
1.75 mm MAX
0.06 g
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.22
+0.03
–0.07
.009
+.001
–.003
1
1.27(.050)
*² 3.90±0.30 6.00±0.40
(.154±.012) (.236±.016)
45˚
0.40(.016)
4
0.44±0.08
(.017±.003)
0.13(.005) M
Details of "A" part
1.55±0.20
(.061±.008)
(Mounting
height)
0.25(.010)
"A"
0~8˚
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
0.10(.004)
©_C20₂0₀2₀₂-2_F0_U0_J8_ITF_SU_UJ_LI_IT_MS_ITU_EDM_FIC₀₈R₀O₀₄E_S-L_cE_-4C_-7TRONICS LIMITED F08004S-c-4-8
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
18
DS05-13105-3E