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UMFT230XA-02 Datasheet, PDF (18/21 Pages) Future Technology Devices International Ltd. – UMFT230XA USB to Basic UART Development Module
8 Contact Information
UMFT230XA Datasheet
Version 1.4
D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9
Head Office – Glasgow, UK
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
s ales 1@f tdic hip.c om
s upport1@f tdic hip.com
admin1@f tdic hip.c om
Branch Office – Tigard, Oregon, USA
Future Technology Devices International Limited (USA)
7130 SW Fir Loop
Tigard, OR 97223-8160
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
us .s ales @f tdic hip.c om
us .s upport@f tdichip.c om
us .admin@f tdic hip.c om
Branch Office – Taipei, Taiwan
Branch Office – Shanghai, China
Future Technology Devices International Limited (Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
Future Technology Devices International Limited (China)
Room 1103, No. 666 West Huaihai Road,
Shanghai, 200052
C hina
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
tw .sales1@ftdichip.com
tw .support1@ftdichip.com
tw .admin1@ftdichip.com
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
c n.s ales @f tdic hip.c om
c n.s upport@f tdichip.c om
c n.admin@f tdic hip.c om
Web Site
http://ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales
representative(s) in your country.
System and equipment manufac turers and des igners are res pons ible to ens ure that their sys tems , and any Future T ec hnology Devi ces
I nternational Ltd (FTDI ) devic es incorporated in their s ystems , meet all applicable safety, regulatory and sys te m-level performanc e
requirements . All application- related information in this doc ument (including applic ation desc riptions , s uggested FTDI devic es and other
materials ) is provided for reference only. While FTDI has taken c are to ass ure it is acc urate, this information is s ubjec t to c us tomer
c onfirmation, and FTDI disclaims all liability for sys tem designs and for any applic ations assis tanc e provided by FTDI . Us e o f FTDI
devic es in life s upport and/or safety applications is entirely at the us er’s risk, and t he us er agrees to defend, indemnify and hold
harmless FTDI from any and all damages , claims , s uits or expens e resulting from s uch use. T his doc ument is s ubject to change without
notice. N o freedom to use patents or other intellec tual property rights is imp lied by the publication of this doc ument. N either the whole
nor any part of the information c ontained in, or the product desc ribed in this document, may be adapted or reproduced in any material
or elec tronic form without the prior written c onsent of the c o pyright holder. Future Tec hnology D evices I nternational L td, U nit 1 , 2
Seaward P lac e, C enturion Business P ark, G lasgow G 4 1 1HH, U nited Kingdom. Sc otland Registered Company N umber: SC136640
Copyright © Future Technology Devices International Limited
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