MCIMX257DJM4A Datasheet, PDF (9/153 Pages) Freescale Semiconductor, Inc – i.MX25 Applications Processor for Consumer and Industrial Products

Table 3. i.MX25 Digital and Analog Modules (continued)
Block
Mnemonic
Block Name Subsystem
Brief Description
SLCD
Smart LCD Multimedia
controller
peripherals
The SLCDC module transfers data from the display memory buffer to the
external display device.
SPBA
Shared
System control The SPBA controls access to the shared peripherals. It supports shared
peripheral bus
peripheral ownership and access rights to an owned peripheral.
arbiter
SSI(2)
I2S/SSI/AC97 Connectivity
interface
peripherals
The SSI is a full-duplex serial port that allows the processor to communicate
with a variety of serial protocols, including the Freescale Semiconductor SPI
standard and the inter-IC sound bus standard (I2S). The SSIs
interface to the AUDMUX for flexible audio routing.
TSC (and ADC) Touchscreen Multimedia
controller (and peripherals
A/D converter)
The touchscreen controller and associated Analog-to-Digital Converter
(ADC) together provide a resistive touchscreen solution. The module
implements simultaneous touchscreen control and auxiliary ADC operation
for temperature, voltage, and other measurement functions.
UART(5)
UART
interface
Connectivity
peripherals
Each of the UART modules supports the following serial data
transmit/receive protocols and configurations:
• 7- or 8-bit data words, one or two stop bits, programmable parity (even,
odd, or none)
• Programmable baud rates up to 4 MHz. This is a higher maximum baud
rate than the 1.875 MHz specified by the TIA/EIA-232-F standard and
previous Freescale UART modules. 32-byte FIFO on Tx and 32 half-word
FIFO on Rx supporting auto-baud
• IrDA-1.0 support (up to SIR speed of 115200 bps)
• Option to operate as 8-pins full UART, DCE, or DTE
USBOTG
USBHOST
High-speed
USB
on-the-go
Connectivity
peripherals
The USB module provides high-performance USB On-The-Go (OTG) and
host functionality (up to 480 Mbps), compliant with the USB 2.0 specification,
the OTG supplement, and the ULPI 1.0 Low Pin Count specification. The
module has DMA capabilities for handling data transfer between internal
buffers and system memory. An OTG HS PHY and HOST FS PHY are also
integrated.
2.1 Special Signal Considerations
Special signal considerations are listed in Table 4. The package contact assignment is found in Section 4,
“Package Information and Contact Assignment.” Signal descriptions are provided in the reference manual.
.
Table 4. Signal Considerations
Signal
BAT_VDD
CLK0
CLK_SEL
EXT_ARMCLK
Description
DryIce backup power supply input.
Clock-out pin; renders the internal clock visible to users for debugging. The clock source is controllable
through CRM registers. This pin can also be configured (through muxing) to work as a normal GPIO.
Used to select the ARM clock source from MPLL out or from external EXT_ARMCLK. In normal operation,
CLK_SEL should be connected to GND.
Primarily for Freescale factory use. There is no internal on-chip pull-up/down on this pin, so it must be
externally connected to GND or VDD. Aside from factory use, this pin can also be configured (through
muxing) to work as a normal GPIO.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
9