MCIMX257DJM4A Datasheet, PDF (124/153 Pages) Freescale Semiconductor, Inc – i.MX25 Applications Processor for Consumer and Industrial Products

Figure 97 shows the USB parallel mode transmit/receive waveform. Table 99 describes the timing
parameters (USB15–USB17) shown in the figure.
USB_Clk
USB_Stp
US15
US15
US16
US16
USB_Data
US17
US17
USB_Dir/Nxt
Figure 97. USB Parallel Mode Transmit/Receive Waveform
Table 99. USB Timing Specification in Parallel Mode
ID
US15
US16
US17
Parameter
Setup time (Dir&Nxt in, Data in)
Hold time (Dir&Nxt in, Data in)
Output delay time (Stp out, Data out
Min.
6.0
0.0
—
Max.
—
—
9.0
Unit Conditions/Reference Signal
ns
10 pF
ns
10 pF
ns
10 pF
4 Package Information and Contact Assignment
4.1 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch
Figure 98 shows the 17×17 mm i.MX25 production package. The following notes apply to Figure 98:
• All dimensions in millimeters.
• Dimensioning and tolerancing per ASME Y14.5M-1994.
• Maximum solder bump diameter measured parallel to datum A.
• Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
• Parallelism measurement shall exclude any effect of mark on top surface of package.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
124
Freescale Semiconductor