MMA25312BT1 Datasheet, PDF (7/12 Pages) Freescale Semiconductor, Inc – Heterojunction Bipolar Transistor Technology (InGaP HBT)

3.00
1.6 x 1.6 Solder Pad
with Thermal Via
Structure
0.70
0.30
2.00 3.40
0.50
Figure 7. PCB Pad Layout for QFN 3×3
MA04
YWZ
Figure 8. Product Marking
RF Device Data
Freescale Semiconductor, Inc.
MMA25312BT1
7