MPXHZ6116A Datasheet, PDF (6/10 Pages) Freescale Semiconductor, Inc – Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.150
3.81
0.050
1.27
TYP
0.387
9.83
0.027 TYP 8X
0.69
0.053 TYP 8X inch
1.35
mm
Figure 5. SSOP Footprint (Case 1317)
MPXHZ6116A
6
Sensors
Freescale Semiconductor