908E626_12 Datasheet, PDF (6/43 Pages) Freescale Semiconductor, Inc – Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
THERMAL RATINGS
Rating
Symbol
Value
Unit
Storage Temperature
Operating Case Temperature ⁽⁵⁾
T_STG
T_C
- 40 to 150
C
- 40 to 115
C
Operating Junction Temperature⁽⁶⁾
T_J
- 40 to 135
C
Peak Package Reflow Temperature During Solder Mounting ⁽⁷⁾⁽⁸⁾
T_PPRT
Note 8
C
Notes
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions
7. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
908E626
6
Analog Integrated Circuit Device Data
Freescale Semiconductor