908E624_12 Datasheet, PDF (6/39 Pages) Freescale Semiconductor, Inc – Integrated Triple High Side Switch Embedded MCU and Lin Serial Communication for Relay Drivers

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Package Operating Ambient Temperature ⁽⁴⁾
MM908E624ACPEW
MM908E624AYPEW
Operating Junction Temperature ⁽²⁾⁽⁴⁾
MM908E624ACPEW
MM908E624AYPEW
T_A
°C
- 40 to 85
- 40 to 125
T_J
°C
- 40 to 125
- 40 to 125
Storage Temperature
Peak Package Reflow Temperature During Reflow⁽³⁾⁽⁵⁾
T_STG
T_PPRT
- 40 to 150
°C
Note 5
°C
Notes
2. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Independent of T_A, device parametrics are only guaranteed for -40 < T_J < 125 °C. Please see note 2. T_J is a factor of power dissipation,
package thermal resistance, and available heat sinking.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
908E624
6
Analog Integrated Circuit Device Data
Freescale Semiconductor