908E624_12 Datasheet, PDF (37/39 Pages) Freescale Semiconductor, Inc – Integrated Triple High Side Switch Embedded MCU and Lin Serial Communication for Relay Drivers

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
θJA
70
60
50
40
30
R^RθθJJA111 1
20
x _R^R_{θθJJAA2222}
10
R_θJA12 = R_θJA21
RθJA12=RθJA21
0
0
300
600
Heat spreading area A [mm²]
Figure 23. Device on Thermal Test Board
100
10
1
x R_θJA11
R_θJA22
R_θJA12 = R_θJA21
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 24. Transient Thermal Resistance R_θJA (1.0 W Step Response)
Device on Thermal Test Board Area A = 600 (mm²)
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E624
37