MPXV5050VC6T1 Datasheet, PDF (5/8 Pages) Freescale Semiconductor, Inc – High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.660
16.76
0.100 TYP
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
inch
2.54
mm
Figure 5. SOP Footprint (Case 482A)
Sensors
Freescale Semiconductor
MPXV5050VC6T1
5