33886_07 Datasheet, PDF (4/25 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Supply Voltage
Input Voltage (1)
FS Status Output ⁽²⁾
Continuous Current ⁽³⁾
ESD Voltage for DH Package
Human Body Model ⁽⁴⁾
Machine Model ⁽⁵⁾
V+
V_IN
V _FS
I_OUT
V_ESD1
V_ESD2
40
V
-0.1 to 7.0
V
7.0
V
5.0
A
V
±2000 ⁽⁶⁾
±200
ESD Voltage for VW Package
Human Body Model ⁽⁴⁾
Machine Model ⁽⁵⁾
V_ESD1
V_ESD2
V
±2000
±200
Storage Temperature
Ambient Operating Temperature ⁽⁷⁾
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow ⁽⁸⁾, ⁽⁹⁾
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) ⁽¹⁰⁾
T_STG
T_A
T_J
T_PPRT
R_θJB
-65 to 150
-40 to 125
-40 to 150
Note 8.
~5.0
°C
°C
°C
°C
°C/W
Notes
1. Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
2. Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
3. Continuous current capability so long as junction temperature is ≤ 150°C.
4. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω).
5. ESD2 testing is performed in accordance with the Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
6. All pins are capable of Human Body Model ESD voltages of ±2000 V with two exceptions pertaining only to the DH suffix package: (1) D2
to PGND is capable of ±1500 V and (2) OUT1 to AGND is capable of ±1000 V.
7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
10. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R_θJB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
33886
4
Analog Integrated Circuit Device Data
Freescale Semiconductor