33886_07 Datasheet, PDF (20/25 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge

PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ASH70702A listed
below.
PIN ONE ID
h X 45 _
E2
1
20
DH SUFFIX
VW (Pb-FREE) SUFFIX
20-PIN HSOP
PLASTIC PACKAGE
98ASH70702A
ISSUE A
E3
D
D1
10
11
B
E1
10X
E
bbb ^M C B
EXPOSED
HEATSINK AREA
E4
A
BOTTOM VIEW
Y
A A2
H
DATUM
PLANE
C
SEATING
PLANE
c ÇÇÉÉÇÇÉÉb1ÇÇÉÉ c1
b
aaa M C A
GAUGE
PLANE
L1
bbb C _q
W
W
L
(1.600)
SECTION W–W
DETAIL Y
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.150 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS –A– AND –B– TO BE DETERMINED AT
DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 3.000 3.400
A1 0.100 0.300
A2 2.900 3.100
A3 0.00 0.100
D 15.800 16.000
D1 11.700 12.600
D2 0.900 1.100
E 13.950 14.450
E1 10.900 11.100
E2 2.500 2.700
E3 6.400 7.200
E4 2.700 2.900
L 0.840 1.100
L1 0.350 BSC
b 0.400 0.520
b1 0.400 0.482
c 0.230 0.320
c1 0.230 0.280
e 1.270 BSC
h ––– 1.100
q 0_{_} 8_{_}
aaa
0.200
bbb
0.100
33886
20
Analog Integrated Circuit Device Data
Freescale Semiconductor