MC68882EI25A Datasheet, PDF (25/26 Pages) Freescale Semiconductor, Inc – HCMOS Enhanced Floating-Point Coprocessor

Freescale Semiconductor, Inc.
FN SUFFIX
PLASTIC LEADED CHIP-CARRIER
CASE 779-02
—B + 0,18(0,007@) T N@P@
L&M@
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L@M@
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A + 0.18(0.007@1
T L@-M@l
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–R _{1+]0.18(0.007@) \T I L@M @l N@-P@]}
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a 0.10(0,004)
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NOTES:
1. DUETO SPACELIMITATIONC,ASE 779-0S2HALL
BE REPRESENTEDBY A GENERAL (SMALLERI
CASE OUTLINEDRAWING RATHERTHAN
SHOWING ALL68LEADS.
2.DATUMS -L.M,-,-N-A,ND -P-DETERMINED
WHERE TOP OF LEAD SHOULDER EXITPLASTIC
BODY AT MOLO PARTINGLINE.
3,DIM Gl,TRUE POSITIONTO BE MEASURED AT
DATUM -T-S,EATINGPLANE.
4,DIM R AND U DO NOT INCLUDEMOLO
PROTRUSION.ALLOWABLE MOLD PROTRUSION
IS0.25(0,010P}ER SIDE,
5.DIMENSIONINGAND TOLERA.NCINPGERANSI
Y14.5M,1982.
6.CONTROLLINGDIMENSION:INCH,
M~
BRW/Rev. 3
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MOTOROLA
25