K61P144M150SF3 Datasheet, PDF (25/82 Pages) Freescale Semiconductor, Inc – K61 Sub-Family Data Sheet

5.4.2 Thermal attributes
Peripheral operating requirements and behaviors
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
Single-layer (1s) R_θJMA
Four-layer (2s2p) R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
144 MAPBGA
Thermal
50
resistance, junction
to ambient (natural
convection)
Thermal
30
resistance, junction
to ambient (natural
convection)
Thermal
41
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
27
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
17
resistance, junction
to board
Thermal
10
resistance, junction
to case
Thermal
2
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
4.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
K61 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
25