K61P144M120SF3_1210 Datasheet, PDF (24/87 Pages) Freescale Semiconductor, Inc – K61 Sub-Family

General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
Single-layer (1s) R_θJMA
Four-layer (2s2p) R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
144 MAPBGA
Thermal
50
resistance, junction
to ambient (natural
convection)
Thermal
30
resistance, junction
to ambient (natural
convection)
Thermal
41
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
27
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
17
resistance, junction
to board
Thermal
10
resistance, junction
to case
Thermal
2
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
K61 Sub-Family Data Sheet, Rev. 4, 10/2012.
24
Freescale Semiconductor, Inc.