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MC9RS08LE4CWL Datasheet, PDF (22/28 Pages) Freescale Semiconductor, Inc – Up to 20 MHz CPU at 2.7 V to 5.5 V across temperature range of –40°C to 85°C
Flash Specifications
Table 14. Flash Characteristics (continued)
Num C
Characteristic
Symbol
Min
Typical1
Max
Unit
VPP current
3 C Program
Mass erase
IVPP_prog
—
IVPP_erase
—
—
200
μA
—
100
μA
4
D
Supply voltage for read operation
0 < fBus < 10 MHz
5
P Byte program time
VRead
1.8
tprog
20
—
5.5
V
—
40
μs
6
P Mass erase time
7
C Cumulative program HV time2
8
C
Total cumulative HV time
(total of tme & thv applied to device)
9 D HVEN to program setup time
10 D PGM/MASS to HVEN setup time
11 D HVEN hold time for PGM
12 D HVEN hold time for MASS
13 D VPP to PGM/MASS setup time
tme
500
thv
—
thv_total
—
tpgs
10
tnvs
5
tnvh
5
tnvh1
100
tvps
20
—
—
ms
—
8
ms
—
2
hours
—
—
μs
—
—
μs
—
—
μs
—
—
μs
—
—
ns
14 D HVEN to VPP hold time
15
D VPP rise time3
16 D Recovery time
tvph
20
tvrs
200
trcv
1
—
—
ns
—
—
ns
—
—
μs
17
D
Program/erase endurance
TL to TH = –40°C to 85°C
—
1000
—
—
cycles
18 C Data retention
tD_ret
100
—
—
years
1 Typicals are measured at 25 °C.
2 thv is the cumulative high voltage programming time to the same row before next erase. Same address can not be
programmed more than twice before next erase.
3 Fast VPP rise time may potentially trigger the ESD protection structure, which may result in over-current flowing into the
pad and cause permanent damage to the pad. External filtering for the VPP power source is recommended. An example
VPP filter is shown in Figure 19.
Figure 19. Example VPP Filtering
MC9RS08LE4 MCU Data Sheet, Rev. 3
22
Freescale Semiconductor