K22P121M50SF4 Datasheet, PDF (20/61 Pages) Freescale Semiconductor, Inc – K22 Sub-Family Data Sheet

General
1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be
recognized in that case.
2. The greater synchronous and asynchronous timing must be met.
3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and
VLLSx modes.
4. 75pF load
5. 15pF load
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p)
R_θJA
Single-layer (1s)
R_θJMA
Four-layer (2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to board
Thermal resistance,
junction to case
Thermal
characterization
parameter, junction to
package top outside
center (natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1,3
1,3
4
5
6
K22 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
20
Freescale Semiconductor, Inc.