K52P144M100SF2 Datasheet, PDF (2/75 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................21
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.......................21
2 Part identification......................................................................4
6.1.2 JTAG electricals..................................................21
2.1 Description.........................................................................4
6.2 System modules................................................................25
2.2 Format...............................................................................4
6.3 Clock modules...................................................................25
2.3 Fields.................................................................................4
6.3.1 MCG specifications.............................................25
2.4 Example............................................................................5
6.3.2 Oscillator electrical specifications.......................27
3 Terminology and guidelines......................................................5
6.3.3 32kHz Oscillator Electrical Characteristics.........29
3.1 Definition: Operating requirement......................................5
6.4 Memories and memory interfaces.....................................30
3.2 Definition: Operating behavior...........................................6
6.4.1 Flash (FTFL) electrical specifications.................30
3.3 Definition: Attribute............................................................6
6.4.2 EzPort Switching Specifications.........................32
3.4 Definition: Rating...............................................................7
6.4.3 Flexbus Switching Specifications........................33
3.5 Result of exceeding a rating..............................................7
6.5 Security and integrity modules..........................................35
3.6 Relationship between ratings and operating
6.6 Analog...............................................................................35
requirements......................................................................7
6.6.1 ADC electrical specifications..............................35
3.7 Guidelines for ratings and operating requirements............8
6.6.2 CMP and 6-bit DAC electrical specifications......43
3.8 Definition: Typical value.....................................................8
6.6.3 12-bit DAC electrical characteristics...................46
3.9 Typical value conditions....................................................9
6.6.4 Op-amp electrical specifications.........................49
4 Ratings......................................................................................9
6.6.5 Transimpedance amplifier electrical
4.1 Thermal handling ratings...................................................10
specifications — full range..................................50
4.2 Moisture handling ratings..................................................10
6.6.6 Transimpedance amplifier electrical
4.3 ESD handling ratings.........................................................10
specifications — limited range............................51
4.4 Voltage and current operating ratings...............................10
6.6.7 Voltage reference electrical specifications..........52
5 General.....................................................................................11
6.7 Timers................................................................................53
5.1 Nonswitching electrical specifications...............................11
6.8 Communication interfaces.................................................54
5.1.1 Voltage and current operating requirements......11
6.8.1 Ethernet switching specifications........................54
5.1.2 LVD and POR operating requirements...............12
6.8.2 USB electrical specifications...............................56
5.1.3 Voltage and current operating behaviors............13
6.8.3 USB DCD electrical specifications......................56
5.1.4 Power mode transition operating behaviors.......13
6.8.4 USB VREG electrical specifications...................56
5.1.5 Power consumption operating behaviors............14
6.8.5 DSPI switching specifications (low-speed
5.1.6 EMC radiated emissions operating behaviors....17
mode)..................................................................57
5.1.7 Designing with radiated emissions in mind.........18
6.8.6 DSPI switching specifications (high-speed
5.1.8 Capacitance attributes........................................18
mode)..................................................................58
5.2 Switching specifications.....................................................18
6.8.7 I2C switching specifications................................60
5.2.1 Device clock specifications.................................18
6.8.8 UART switching specifications............................60
5.2.2 General switching specifications.........................19
6.8.9 SDHC specifications...........................................60
5.3 Thermal specifications.......................................................20
6.8.10 I2S switching specifications................................61
5.3.1 Thermal operating requirements.........................20
6.9 Human-machine interfaces (HMI)......................................63
5.3.2 Thermal attributes...............................................20
6.9.1 TSI electrical specifications................................63
6 Peripheral operating requirements and behaviors....................20
7 Dimensions...............................................................................64
K52 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.