K51P121M100SF2 Datasheet, PDF (2/70 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................21
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.........................21
2 Part identification......................................................................4
6.1.2 JTAG electricals....................................................21
2.1 Description.........................................................................4
6.2 System modules................................................................25
2.2 Format...............................................................................4
6.3 Clock modules...................................................................25
2.3 Fields.................................................................................4
6.3.1 MCG specifications...............................................25
2.4 Example............................................................................5
6.3.2 Oscillator electrical specifications.........................27
3 Terminology and guidelines......................................................5
6.3.3 32kHz Oscillator Electrical Characteristics............29
3.1 Definition: Operating requirement......................................5
6.4 Memories and memory interfaces.....................................30
3.2 Definition: Operating behavior...........................................6
6.4.1 Flash (FTFL) electrical specifications....................30
3.3 Definition: Attribute............................................................6
6.4.2 EzPort Switching Specifications............................34
3.4 Definition: Rating...............................................................7
6.5 Security and integrity modules..........................................35
3.5 Result of exceeding a rating..............................................7
6.6 Analog...............................................................................35
3.6 Relationship between ratings and operating
6.6.1 ADC electrical specifications.................................36
requirements......................................................................7
6.6.2 CMP and 6-bit DAC electrical specifications.........43
3.7 Guidelines for ratings and operating requirements............8
6.6.3 12-bit DAC electrical characteristics.....................46
3.8 Definition: Typical value.....................................................8
6.6.4 Op-amp electrical specifications...........................49
3.9 Typical value conditions....................................................9
6.6.5 Transimpedance amplifier electrical
4 Ratings......................................................................................9
specifications — full range....................................50
4.1 Thermal handling ratings...................................................10
6.6.6 Transimpedance amplifier electrical
4.2 Moisture handling ratings..................................................10
specifications — limited range..............................51
4.3 ESD handling ratings.........................................................10
6.6.7 Voltage reference electrical specifications............52
4.4 Voltage and current operating ratings...............................10
6.7 Timers................................................................................53
5 General.....................................................................................11
6.8 Communication interfaces.................................................54
5.1 Nonswitching electrical specifications...............................11
6.8.1 USB electrical specifications.................................54
5.1.1 Voltage and current operating requirements.........11
6.8.2 USB DCD electrical specifications........................54
5.1.2 LVD and POR operating requirements.................12
6.8.3 USB VREG electrical specifications......................54
5.1.3 Voltage and current operating behaviors..............13
6.8.4 DSPI switching specifications (low-speed mode)..55
5.1.4 Power mode transition operating behaviors..........13
6.8.5 DSPI switching specifications (high-speed mode) 56
5.1.5 Power consumption operating behaviors..............14
6.8.6 I2C switching specifications..................................58
5.1.6 EMC radiated emissions operating behaviors.......17
6.8.7 UART switching specifications..............................58
5.1.7 Designing with radiated emissions in mind...........18
6.8.8 SDHC specifications.............................................58
5.1.8 Capacitance attributes..........................................18
6.8.9 I2S switching specifications..................................59
5.2 Switching specifications.....................................................18
6.9 Human-machine interfaces (HMI)......................................61
5.2.1 Device clock specifications...................................18
6.9.1 TSI electrical specifications...................................61
5.2.2 General switching specifications...........................19
6.9.2 LCD electrical characteristics................................62
5.3 Thermal specifications.......................................................20
7 Dimensions...............................................................................63
5.3.1 Thermal operating requirements...........................20
7.1 Obtaining package dimensions.........................................63
5.3.2 Thermal attributes.................................................20
8 Pinout........................................................................................64
6 Peripheral operating requirements and behaviors....................20
8.1 K51 Signal Multiplexing and Pin Assignments..................64
K51 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.