K20P81M100SF2V2 Datasheet, PDF (2/71 Pages) Freescale Semiconductor, Inc – K20 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
6 Peripheral operating requirements and behaviors....................21
1.1 Determining valid orderable parts......................................3
6.1 Core modules....................................................................21
2 Part identification......................................................................3
6.1.1 Debug trace timing specifications.......................21
2.1 Description.........................................................................3
6.1.2 JTAG electricals..................................................22
2.2 Format...............................................................................3
6.2 System modules................................................................25
2.3 Fields.................................................................................3
6.3 Clock modules...................................................................25
2.4 Example............................................................................4
6.3.1 MCG specifications.............................................25
3 Terminology and guidelines......................................................4
6.3.2 Oscillator electrical specifications.......................27
3.1 Definition: Operating requirement......................................4
6.3.3 32 kHz Oscillator Electrical Characteristics........30
3.2 Definition: Operating behavior...........................................5
6.4 Memories and memory interfaces.....................................30
3.3 Definition: Attribute............................................................5
6.4.1 Flash electrical specifications.............................30
3.4 Definition: Rating...............................................................6
6.4.2 EzPort Switching Specifications.........................32
3.5 Result of exceeding a rating..............................................6
6.4.3 Flexbus Switching Specifications........................33
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................36
requirements......................................................................6
6.6 Analog...............................................................................36
3.7 Guidelines for ratings and operating requirements............7
6.6.1 ADC electrical specifications..............................36
3.8 Definition: Typical value.....................................................7
6.6.2 CMP and 6-bit DAC electrical specifications......44
3.9 Typical value conditions....................................................8
6.6.3 12-bit DAC electrical characteristics...................47
4 Ratings......................................................................................9
6.6.4 Voltage reference electrical specifications..........50
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................51
4.2 Moisture handling ratings..................................................9
6.8 Communication interfaces.................................................51
4.3 ESD handling ratings.........................................................9
6.8.1 USB electrical specifications...............................51
4.4 Voltage and current operating ratings...............................9
6.8.2 USB DCD electrical specifications......................52
5 General.....................................................................................10
6.8.3 USB VREG electrical specifications...................52
5.1 AC electrical characteristics..............................................10
6.8.4 CAN switching specifications..............................53
5.2 Nonswitching electrical specifications...............................10
6.8.5 DSPI switching specifications (limited voltage
5.2.1 Voltage and current operating requirements......11
range).................................................................53
5.2.2 LVD and POR operating requirements...............12
6.8.6 DSPI switching specifications (full voltage
5.2.3 Voltage and current operating behaviors............12
range).................................................................54
5.2.4 Power mode transition operating behaviors.......13
6.8.7 I2C switching specifications................................56
5.2.5 Power consumption operating behaviors............14
6.8.8 UART switching specifications............................56
5.2.6 EMC radiated emissions operating behaviors....17
6.8.9 SDHC specifications...........................................56
5.2.7 Designing with radiated emissions in mind.........18
6.8.10 I2S/SAI Switching Specifications........................57
5.2.8 Capacitance attributes........................................18
6.9 Human-machine interfaces (HMI)......................................64
5.3 Switching specifications.....................................................18
6.9.1 TSI electrical specifications................................64
5.3.1 Device clock specifications.................................18
7 Dimensions...............................................................................65
5.3.2 General switching specifications.........................19
7.1 Obtaining package dimensions.........................................65
5.4 Thermal specifications.......................................................20
8 Pinout........................................................................................65
5.4.1 Thermal operating requirements.........................20
8.1 K20 Signal Multiplexing and Pin Assignments..................65
5.4.2 Thermal attributes...............................................20
8.2 K20 Pinouts.......................................................................69
K20 Sub-Family Data Sheet, Rev. 1, 6/2012.
2
Preliminary
Freescale Semiconductor, Inc.
General Business Information