MC145572 Datasheet, PDF (199/264 Pages) Freescale Semiconductor, Inc – ISDN U-INTERFACE TRANSCEIVER

11.2
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
PLCC PACKAGE
CASE 777-02
-N-
Y BRK
D
B
0.007 (0.180) ^M T L -M ^S N ^S
U
0.007 (0.180) ^M T L -M ^S N ^S
-L-
-M-
Z
V
44
1
D
W
X
VIEW D-D
G1
0.010 (0.250) ^S T L -M ^S N ^S
A
0.007 (0.180) ^M T L -M ^S N ^S
H
0.007 (0.180) ^M T L -M ^S N ^S
R
0.007 (0.180) ^M T L -M ^S N ^S
Z
C
E
G
G1
0.010 (0.250) S T L -M S N S
J
-T-
0.004 (0.100)
SEATING
PLANE
VIEW S
K1
K
F
VIEW S
0.007 (0.180) ^M T L -M ^S N ^S
NOTES:
1. DATUMS ĆLĆ, ĆMĆ, AND ĆNĆ DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM ĆTĆ, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS (0.010) 0.25
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.685
0.695
0.685
0.695
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
Ċ
0.025
Ċ
0.650
0.656
0.650
0.656
0.042
0.048
0.042
0.048
0.042
0.056
Ċ
0.020
2°
10°
0.610
0.630
0.040
Ċ
MILLIMETERS
MIN
MAX
17.40
17.65
17.40
17.65
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
Ċ
0.64
Ċ
16.51
16.66
16.51
16.66
1.07
1.21
1.07
1.21
1.07
1.42
Ċ
0.50
2°
10°
15.50
16.00
1.02
Ċ
Figure 11–3. MC145572FN Mechanical Outline
MOTOROLA
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