K30P144M100SF2 Datasheet, PDF (19/67 Pages) Freescale Semiconductor, Inc – K30 Sub-Family Data Sheet

General
2. V_DD = 3 V, T_A = 25 °C, f_OSC = 16 MHz (crystal), f_BUS = 20 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
5.1.7 Designing with radiated emissions in mind
1. To find application notes that provide guidance on designing your system to
minimize interference from radiated emissions, go to www.freescale.com and
perform a keyword search for “EMC design.”
y 5.1.8 Capacitance attributes
Table 7. Capacitance attributes
r _Symbol
a _{CIN_A}
in ^CIN_D
Description
Input capacitance: analog pins
Input capacitance: digital pins
Min.
—
—
Max.
7
7
Unit
pF
pF
5.2 Switching electrical specifications
lim _Symbol
e _fSYS
r _fBUS
P ^FB_CLK
Table 8. Device clock specifications
Description
System and core clock
Normal run mode
Min.
—
Max.
100
Bus clock
—
50
FlexBus clock
—
50
Unit
MHz
MHz
MHz
Notes
f_FLASH Flash clock
—
25
MHz
VLPR mode
f_SYS
System and core clock
—
2
MHz
f_BUS
Bus clock
—
2
MHz
FB_CLK FlexBus clock
—
2
MHz
f_FLASH Flash clock
—
1
MHz
5.3 Thermal specifications
K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
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