MC9S08AW32CPUE Datasheet, PDF (17/324 Pages) Freescale Semiconductor, Inc – Microcontrollers

Section Number
Title
Page
Chapter 15
Development Support
15.1 Introduction ...................................................................................................................................261
15.1.1 Features .........................................................................................................................262
15.2 Background Debug Controller (BDC) ..........................................................................................262
15.2.1 BKGD Pin Description .................................................................................................263
15.2.2 Communication Details ................................................................................................264
15.2.3 BDC Commands ...........................................................................................................268
15.2.4 BDC Hardware Breakpoint ..........................................................................................270
15.3 On-Chip Debug System (DBG) ....................................................................................................271
15.3.1 Comparators A and B ...................................................................................................271
15.3.2 Bus Capture Information and FIFO Operation .............................................................271
15.3.3 Change-of-Flow Information ........................................................................................272
15.3.4 Tag vs. Force Breakpoints and Triggers .......................................................................272
15.3.5 Trigger Modes ..............................................................................................................273
15.3.6 Hardware Breakpoints ..................................................................................................275
15.4 Register Definition ........................................................................................................................275
15.4.1 BDC Registers and Control Bits ...................................................................................275
15.4.2 System Background Debug Force Reset Register (SBDFR) ........................................277
15.4.3 DBG Registers and Control Bits ..................................................................................278
Appendix A
Electrical Characteristics and Timing Specifications
A.1 Introduction ....................................................................................................................................283
A.2 Parameter Classification.................................................................................................................283
A.3 Absolute Maximum Ratings...........................................................................................................283
A.4 Thermal Characteristics..................................................................................................................285
A.5 ESD Protection and Latch-Up Immunity .......................................................................................286
A.6 DC Characteristics..........................................................................................................................287
A.7 Supply Current Characteristics.......................................................................................................291
A.8 ADC Characteristics.......................................................................................................................293
A.9 Internal Clock Generation Module Characteristics ........................................................................296
A.9.1 ICG Frequency Specifications.......................................................................................297
A.10 AC Characteristics..........................................................................................................................300
A.10.1 Control Timing ..............................................................................................................300
A.10.2 Timer/PWM (TPM) Module Timing.............................................................................302
A.11 SPI Characteristics .........................................................................................................................303
A.12 FLASH Specifications....................................................................................................................306
A.13 EMC Performance..........................................................................................................................307
A.13.1 Radiated Emissions .......................................................................................................307
A.13.2 Conducted Transient Susceptibility...............................................................................307
MC9S08AW60 Data Sheet, Rev 2
Freescale Semiconductor
17