MCIMX31 Datasheet, PDF (1/170 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processors

Freescale Semiconductor
Advance Information
Document Number: MCIMX31
Rev. 1.4, 04/2006
MCIMX31 and
MCIMX31L
i.MX31 and i.MX31L
Multimedia Applications
Processors
Package Information
Plastic Package
Case 1581-01 14 x 14 mm, 0.5 P
Ordering Information
Device
Operating
Temperature Range
Package
MCIMX31VKN5 0°C to +70°C MAPBGA–457
MCIMX31LVKN5 0°C to +70°C MAPBGA–457
1 Introduction
The i.MX31 (MCIMX31) and i.MX31L (MCIMX31L)
are multimedia applications processors that represent the
next step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX31 and
i.MX31L processors.
Based on an ARM11^™ microprocessor core, the
i.MX31 and i.MX31L provide the performance with
low power consumption required by modern digital
devices such as:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and Wireless
PDAs
• Portable DVD players
• Digital cameras
The i.MX31 and i.MX31L take advantage of the
ARM1136JF-S^™ core running at typical speeds of
532 MHz, and is optimized for minimal power
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 2
2 Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 ARM11 Microprocessor Core . . . . . . . . . . . 3
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 8
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . 23
3.1 i.MX31 and i.MX31L I/O Pad Signal
Settings . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4 Electrical Characteristics . . . . . . . . . . . . . . 60
4.1 i.MX31 and i.MX31L
Chip-Level Conditions . . . . . . . . . . . . . . . 60
4.2 Supply Power-Up Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . 65
4.3 Module-Level Electrical Specifications . . . 66
5 Package Information and Pinout . . . . . . . 152
5.1 MAPBGA Production Package
457 14 x 14 mm, 0.5 P . . . . . . . . . . . . . . 153
6 Product Documentation . . . . . . . . . . . . . . . 167
6.1 Revision History . . . . . . . . . . . . . . . . . . . 167
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005, 2006. All rights reserved.
Preliminary