IMX53CEC Datasheet, PDF (1/204 Pages) Freescale Semiconductor, Inc – Applications Processors for Consumer Products

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX53CEC
Rev. 2, 5/2011
MCIMX53xD
i.MX53xD Applications
Processors for Consumer
Products
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Case FC-PBGA PoP 12 x 12 mm
Ordering Information
See Table 1 on page 3
1 Introduction
The i.MX53xD multimedia application processor is
Freescale Semiconductor’s latest addition to a growing
family of multimedia-focused products offering high
performance processing optimized for lowest power
consumption.
The i.MX53xD processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 1 GHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is suitable for
applications such as the following:
• Tablets, high-end mobile internet devices (MID)
• Smart mobile devices
• Thin clients
• Internet monitors, media phones, high-end
portable media players (PMP) with HD video
capability
• Gaming consoles
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Power Supplies Requirements and Restrictions . 25
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28
4.4. Output Buffer Impedance Characteristics . . . . . . 35
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46
4.7. External Peripheral Interfaces Parameters . . . . . . 68
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 146
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 147
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 147
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 148
5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 149
6. Package Information and Contact Assignments . . . . . 150
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 150
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169
6.3. PoP 12 x 12 mm Package on Package (PoP)
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
The flexibility of the i.MX53xD architecture allows for
its use in a wide variety of applications. As the heart of
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© 2011 Freescale Semiconductor, Inc. All rights reserved.