IMX53AEC Datasheet, PDF (1/178 Pages) Freescale Semiconductor, Inc – Automotive and Infotainment Applications Processors

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX53AEC
Rev. 2, 5/2011
MCIMX53xA
i.MX53xA Automotive and
Infotainment Applications
Processors
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
1 Introduction
The MCIMX53xA (i.MX53xA) automotive
infotainment processor is Freescale Semiconductor’s
latest addition to a growing family of
multimedia-focused products offering high performance
processing with a high degree of functional integration
aimed at the growing automotive infotainment,
telematics, HMI, and display-based cluster markets. This
device includes 3D and 2D graphics processors, 1080i/p
video processing, and dual display, and provides a
variety of interfaces.
The i.MX53xA processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 800 MHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is well suited for
graphics rendering for HMI, navigation, high
performance speech processing with large databases,
video processing and display, audio playback, and many
other applications.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Power Supplies Requirements and Restrictions . 24
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 27
4.4. Output Buffer Impedance Characteristics . . . . . . 34
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45
4.7. External Peripheral Interfaces Parameters . . . . . . 67
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 148
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 149
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 149
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 150
5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 151
6. Package Information and Contact Assignments . . . . . 152
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 152
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 171
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
The flexibility of the i.MX53xA architecture allows for
its use in a wide variety of applications. As the heart of
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© 2011 Freescale Semiconductor, Inc. All rights reserved.