EFD25 Datasheet, PDF (5/7 Pages) NXP Semiconductors – EFD cores and accessories

Ferroxcube
EFD cores and accessories
EFD25/13/9
COIL FORMERS
General data
PARAMETER
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
SPECIFICATION
Sumikon PM-9630 (PF), glass-reinforced, flame retardant in accordance with “UL
94V-0” ; UL file number E41429
copper-tin alloy (CuSn), Gold (Au) plated
180 °C, “IEC 60085”, class H
“IEC 60068-2-20” , Part 2, Test Tb, method 1B, 350 °C, 3.5 s
“IEC 60068-2-20” , Part 2, Test Ta, method 1: 235 °C, 2 s
12.5
± 0.2
1.2
(10x)
Dimensions in mm.
18 _−
0
0.15
13
+
0.1
0
11.7
+
0.1
0
5.5
+
0.1
0
3.75 ± 0.1
11.25 ± 0.1
18.75 ± 0.1
25 ± 0.2
1.5 (10x)
0.9 (4x)
18 _−
0
0.15
16.45 min
26
28 ± 0.2
30.1 ± 0.2
31.5 ± 0.2
6.8
+
0.1
0
28
0.4
± 0.05
2.75
2
3.75
MFP032
Fig.3 EFD25/13/9 coil former (SMD) ; 12-pins.
Winding data and area product for EFD25/13/9 coil former with 12-pins
NUMBER OF
SECTIONS
1
WINDING
AREA
(mm²)
39.0
MINIMUM
WINDING
WIDTH
(mm)
16.45
AVERAGE
LENGTH OF
TURN
(mm)
46.4
AREA
PRODUCT
Ae x Aw
(mm⁴)
2260
TYPE NUMBER
CSHS-EFD25-1S-12P
2008 Sep 01
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