EFD25 Datasheet, PDF (4/7 Pages) NXP Semiconductors – EFD cores and accessories

Ferroxcube
EFD cores and accessories
EFD25/13/9
COIL FORMERS
General data
PARAMETER
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
SPECIFICATION
phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with
“UL 94V-0” ; UL file number E167521(M)
copper-tin alloy (CuSn), tin (Sn) plated, see note 1
180 °C, “IEC 60085”, class H
“IEC 60068-2-20” , Part 2, Test Tb, method 1B, 350 °C, 3.5 s
“IEC 60068-2-20” , Part 2, Test Ta, method 1: 235 °C, 2 s
18 −0.2
13.1 −0.2
11.78 +0.1
18 −0.2
(16.4 min.)
handbook, full pagewidth
12.55 12
max. −0.2
3.6
5.53 +0.1 6.9 −0.1
1.3
±0.15
10
∅0.8
20
22.5
5
CBW501
25.2 max.
26.2 max.
Dimensions in mm.
Fig.2 EFD25/13/9 coil former; 10-pins.
Winding data and area product for EFD25/13/9 coil former with 10-pins
NUMBER OF
SECTIONS
1
WINDING
AREA
(mm²)
40.2
MINIMUM
WINDING
WIDTH
(mm)
16.4
AVERAGE
LENGTH OF
TURN
(mm)
46.4
AREA
PRODUCT
Ae x Aw
(mm⁴)
2330
TYPE NUMBER
CSH-EFD25-1S-10P⁽¹⁾
1. Also available with post-inserted pins.
2008 Sep 01
4