FAN2106 Datasheet, PDF (4/14 Pages) Fairchild Semiconductor – TinyBuck 6A, 24V Input Integrated Synchronous Buck Regulator

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
PVIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
Conditions
AGND = PGND
Continuous
Transient (t < 20nsec, F < 600KHz)
Min.
-0.3
-0.5
-5
-0.3
Max.
28
6
35
6
24
30
V_CC+0.3
Unit
V
V
V
V
V
V
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
V_CC
V_IN
T_A
T_J
Parameter
Bias Voltage
Supply Voltage
Ambient Temperature
Junction Temperature
Conditions
VCC to AGND
PVIN to PGND
FAN2106M
FAN2106EM
Min.
4.5
3
-10
-40
Typ.
5.0
Max.
5.5
24
85
85
125
Unit
V
V
°C
°C
°C
Thermal Information
Symbol
Parameter
Min.
Typ.
Max. Unit
T_STG
Storage Temperature
-65
150
°C
T_L
Lead Soldering Temperature, 10 seconds
300
°C
T_VP
Vapor Phase, 60 seconds
215
°C
T_I
Infrared, 15 seconds
220
°C
θ_JC
Thermal Resistance:
Junction-to-Case
P1 (Q2)
P2 (Q1)
P3
4
°C/W
7
°C/W
4
°C/W
θ_J-PCB
P_D
Thermal Resistance: Junction-to-Mounting Surface
Power Dissipation, T_A = 25°C
35⁽¹⁾
2.8⁽¹⁾
°C/W
W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results
are dependent on mounting method and surface related to the design.
© 2006 Fairchild Semiconductor Corporation
FAN2106 Rev. 1.0.1
4
www.fairchildsemi.com