FAN2103 Datasheet, PDF (4/14 Pages) Fairchild Semiconductor – 3A, 24V Input Integrated Synchronous Buck Regulator

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
ESD
Conditions
AGND = PGND
Transient (t < 20ns, F < 600KHz)
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.3
-5
-0.3
2.0
2.0
Max.
28
6
35
6.0
30
VCC+0.3
Unit
V
V
V
V
V
V
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
VIN
Parameter
Bias Voltage
Supply Voltage
TA
Ambient Temperature
TJ
Junction Temperature
Conditions
VCC to AGND
VIN to PGND
FAN2103M
FAN2103EM
Min.
4.5
3
-10
-40
Typ.
5.0
Max.
5.5
24
+85
+85
+125
Unit
V
V
°C
°C
°C
Thermal Information
Symbol
Parameter
Min. Typ. Max. Unit
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+300
°C
TVP
Vapor Phase, 60 Seconds
+215
°C
TI
Infrared, 15 Seconds
+220
°C
P1 (Q2)
4
°C/W
θJC
Thermal Resistance: Junction-to-Case
P2 (Q1)
7
°C/W
P3
4
°C/W
θJ-PCB
PD
Thermal Resistance: Junction-to-Mounting Surface
Power Dissipation, TA = 25°C
35⁽¹⁾
2.8⁽¹⁾
°C/W
W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 26. Actual results
are dependent on mounting method and surface related to the design.
© 2007 Fairchild Semiconductor Corporation
FAN2103 Rev. 1.0.3
4
www.fairchildsemi.com