FDMS86101DC Datasheet, PDF (3/8 Pages) Fairchild Semiconductor – N-Channel Dual CoolTM Power Trench® MOSFET 100 V, 60 A, 7.5 mΩ

Thermal Characteristics
R_θJC
R_θJC
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
R_θJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Top Source)
2.3
(Bottom Drain)
1.0
(Note 1a)
38
(Note 1b)
81
(Note 1c)
27
(Note 1d)
34
(Note 1e)
16
(Note 1f)
19
(Note 1g)
26
(Note 1h)
61
(Note 1i)
16
(Note 1j)
23
(Note 1k)
11
(Note 1l)
13
°C/W
NOTES:
1. R_θJA is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R_θJC is guaranteed by design while R_θCA is determined
by the user's board design.
a. 38 °C/W when mounted on
a 1 in² pad of 2 oz copper
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in² pad of 2 oz copper
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in² pad of 2 oz copper
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in² pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in² pad of 2 oz copper
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in² pad of 2 oz copper
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. Starting T_J = 25 ^oC; N-ch: L = 0.3 mH, I_AS = 38 A, V_DD = 90 V, V_GS = 10 V.
©2012 Fairchild Semiconductor Corporation
3
FDMS86101DC Rev. C1
www.fairchildsemi.com