FAN4603 Datasheet, PDF (3/12 Pages) Fairchild Semiconductor – 600mA, Fully Integrated, Buck Power Supply Module

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
VIN
TJ
TSTG
TL
ESD
Parameter
Input Voltage with Respect to GND
Voltage on Any Other Pin with Respect to GND
Junction Temperature
Storage Temperature
Lead Temperature (Soldering, 10 Seconds)
Electrostatic Discharge
Capability
Human Body Model JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.3
-0.3
-40
-65
6
2
Max.
6.0
VIN
+150
+150
+260
Units
V
V
°C
°C
°C
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to Absolute Maximum Ratings.
Symbol
VCC
IOUT
TA
TJ
Parameter
Supply Voltage Range
Output Current
Operating Ambient Temperature
Operating Junction Temperature
Min.
2.3
0
-40
-40
Max.
5.5
600
+85
+125
Units
V
mA
°C
°C
Thermal Properties
Symbol
ΘJA
Parameter
Junction-to-Ambient Thermal Resistance⁽²⁾
Typical
120
Units
°C/W
Note:
2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with a two-
layer 2s0p board in accordance to the JESD51- JEDEC standard. Special attention must be paid not to exceed junction
temperature TJ(max) at a given ambient temperature TA.
© 2009 Fairchild Semiconductor Corporation
FAN4603 • Rev. 1.0.1
3
www.fairchildsemi.com