FAN4603 Datasheet, PDF (11/12 Pages) Fairchild Semiconductor – 600mA, Fully Integrated, Buck Power Supply Module

Physical Dimensions
0.05 A
2X
2.50
1
PIN A1
MARK
CL
3
CL
TOP VIEW
1.10
0.90
A
B
CL
P1
0.25
0.95
0.95
0.13
0.32
0.50
6
1
3.70
0.78
4.00
1.10
0.40
6 ^1.45
0.10
CL _0.50
4
1.30 ³
0.05 B
2X
0.63
0.80
2.70
1.45
4 _0.30
0.10 C
LAND PATTERN
RECOMMENDATION
0.05
0.00
2.50
0.85
0.65 CL
1.20 ³
CL
0.50
0.30
2
1.25
1.15
1
0.08 C
C
SEATING
PLANE
NOTES:
A) THIS PACKAGE IS NOT
PRESENTLY REGISTERED WITH
ANY STANDARDS COMMITTEE.
B) DIMENSIONS ARE IN
P1
MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF
BURRS, MOLD FLASH, AND TIE
4
1.45
1.35
0.68
5 _0.48
BAR PROTRUSIONS.
D) DRAWING CONFORMS TO ASME
Y14.5M-1994
E) DRAWING FILENAME:
MKT-MOD06AArev3
6 ^0.40
4.00
0.15
PIN A1
MARK
(0.40)
0.23
(0.25)
BOTTOM VIEW
Figure 30.6-Lead, MicroModule QFN 2.5 x 4 x 1mm
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN4603 • Rev. 1.0.1
11
www.fairchildsemi.com