FAN3226_11 Datasheet, PDF (2/25 Pages) Fairchild Semiconductor – Dual 2A High-Speed, Low-Side Gate Drivers

Ordering Information
Part Number
Logic
FAN3226CMPX
FAN3226CMX
FAN3226TMPX
FAN3226TMX
FAN3227CMPX
FAN3227CMX
FAN3227TMPX
FAN3227TMX
FAN3228CMPX
FAN3228CMX
FAN3228TMPX
FAN3228TMX
FAN3229CMPX
FAN3229CMX
FAN3229TMPX
FAN3229TMX
Dual Inverting Channels +
Dual Enable
Dual Non-Inverting Channels
+ Dual Enable
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 1
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 2
Input
Threshold
CMOS
TTL
CMOS
TTL
CMOS
TTL
CMOS
TTL
Package
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
Package Outlines
Packing Method
Quantity
per Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
Figure 2. 3x3mm MLP-8 (Top View)
Figure 3. SOIC-8 (Top View)
Thermal Characteristics⁽¹⁾
Package
_JL(2) _JT(3) _JA(4) _JB(5) _JT(6) Units
8-Lead 3x3mm Molded Leadless Package (MLP)
1.6
68
43
3.5
0.8
°C/W
8-Pin Small Outline Integrated Circuit (SOIC)
40
31
89
43
3.0
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (_JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (_JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (Θ_JA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (_JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
6. Psi_JT (_JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
© 2007 Fairchild Semiconductor Corporation
FAN3226 / FAN3227 / FAN3228 / FAN3229 • Rev. 1.0.7
2
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