FAN3121 Datasheet, PDF (2/21 Pages) Fairchild Semiconductor – Single 9A High-Speed, Low-Side Gate Driver

Ordering Information
Part Number
Logic
FAN3121CMPX
FAN3121CMX _{Inverting Channels +}
FAN3121TMPX ^Enable
FAN3121TMX
FAN3122CMPX
FAN3122CMX _{Non-Inverting Channels +}
FAN3122TMPX ^Enable
FAN3122TMX
Input
Threshold
Package
CMOS
TTL
CMOS
TTL
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
Eco
Status
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
Packing Quantity
Method per Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outlines
Figure 3. 3x3mm MLP-8 (Top View)
Figure 4. SOIC-8 (Top View)
Thermal Characteristics⁽¹⁾
Package
Θ_JL(2) Θ_JT(3) Θ_JA(4) Ψ_JB(5) Ψ_JT(6) Units
8-Lead 3x3mm Molded Leadless Package (MLP)
1.2
64
42
2.8
0.7
°C/W
8-Pin Small Outline Integrated Circuit (SOIC)
38
29
87
41
2.3
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards
JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.
© 2008 Fairchild Semiconductor Corporation
FAN3121 / FAN3122 • Rev. 1.0.0
2
www.fairchildsemi.com