FAN3121 Datasheet, PDF (19/21 Pages) Fairchild Semiconductor – Single 9A High-Speed, Low-Side Gate Driver

Physical Dimensions
2X
0.8 MAX
0.05
0.00
SEATING
PLANE
2X
RECOMMENDED LAND PATTERN
A. CONFORMS TO JEDEC REGISTRATION MO-229,
VARIATION VEEC, DATED 11/2001
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
D. FILENAME: MKT-MLP08Drev2
Figure 55. 3x3mm, 8-Lead Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN3121 / FAN3122 • Rev. 1.0.0
19
www.fairchildsemi.com