FAN7389 Datasheet, PDF (17/18 Pages) Fairchild Semiconductor – 3-Phase Half-Bridge Gate-Drive IC

Package Dimensions
24
B
15.40±0.20
13.970
7.50±0.10
10.325
A
13
14.52
10.95
9.2
1
PIN ONE
INDICATOR
0.51
0.35
0.25 M C B A
12
1.27
1.75 TYP
1.27 TYP
0.55 TYP
LAND PATTERN RECOMMENDATION
2.65 MAX
(R0.10)
(R0.10)
8°
0°
0.40~1.27
(1.40)
0.20±0.10
0.75
0.25
X 45°
C
0.10 C
GAGE PLANE
0.25
SEATING PLANE
DETAIL A
SCALE: 2:1
SEE DETAIL A
0.33
0.20
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, ISSUE E, DATED SEPT 2005.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATERN STANDARD: SOIC127P1030X265-24L
E) DRAWING FILENAME: MKT-M24BREV2
Figure 46.24-Lead Small Outline Integrated Circuit (24-Wide Body SOIC)
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the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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© 2010 Fairchild Semiconductor Corporation
FAN7389 • Rev. 1.0.0
17
www.fairchildsemi.com