|
FQPF3P20 Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – QFET P-CHANNEL | |||
|
QFET P-CHANNEL
FEATURES
⢠Advanced New Design
⢠Avalanche Rugged Technology
⢠Rugged Gate Oxide Technology
⢠Very Low Intrinsic Capacitances
⢠Excellent Switching Characteristics
⢠Unrivalled Gate Charge: 6.0nC (Typ.)
⢠Extended Safe Operating Area
⢠Lower RDS(ON): 2.06⦠(Typ.)
ABSOLUTE MAXIMUM RATINGS
Symbol
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
PD
TJ, TSTG
TL
Characteristics
Drain-to-Source Voltage
Continuous Drain Current (TC = 25°C)
Continuous Drain Current (TC = 100°C)
Drain Current-Pulsed
x
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
y
Avalanche Current
x
Repetitive Avalanche Energy
x
Peak Diode Recovery dv/dt
z
Total Power Dissipation (TC = 25°C)
Linear Derating Factor
Operating Junction and Storage
Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8â from case for 5-seconds
THERMAL RESISTANCE
Symbol
RθJC
RθJA
Characteristics
Junction-to-Case
Junction-to-Ambient
FQPF3P20
BVDSS = â200V
RDS(ON) = 2.7â¦
ID = â2.2A
TO-220F
1
2
3
1. Gate 2. Drain 3. Source
Value
â200
â2.2
â1.39
â8.8
±30
150
â2.2
3.2
â5.5
32
0.26
â55 to +150
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W/°C
°C
Typ.
â
â
Max.
3.9
62.5
Units
°C/W
© 1999 Fairchild Semiconductor Corporation
REV. B
1
|
▷ |