ES25P40 Datasheet, PDF (33/35 Pages) Excel Semiconductor Inc. – 4Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface

ADVANCED INFORMATION
EE SS II
Excel Semiconductor inc.
PHYSICAL DIMENSIONS
S08 wide - 8 pin Plastic Small Outline 208 mils Body Width Package
3
4
D
A
5
3
4
E1
E1/2
0.20 C A-B
D
9
H
SEE
DETAIL B
E
E/2
b
(c)
WITH
PLATING
c1
b1
7
BASE
METAL
SECTION A-A
e
B
A A2
A1
b
0.33 C
0.25 M C A-B D
H
5
// 0.10 C
θ1
C
0.10 C
SEATING PLANE
C
L
L1
θ2
A
A
0.07 R MIN.
GAUGE
PLANE
SEATING
PLANE
θ
L2
DETAIL B
Package
JEDEC
Symbol
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
L2
N
θ
θ1
θ2
SOC 008 (inches)
MIN
MAX
0.069 0.085
0.002 0.0098
0.067 0.075
0.014 0.018
0.013 0.018
0.0075 0.0095
0.006 0.008
0.208 BSC
0.315 BSC
0.208 BSC
0.050 BSC
0.020 0.030
0.055 REF
0.010 BSC
8
0’
8’
5’
15’
0’
SOC 008 (mm)
MIN MAX
1.753 2.159
0.051 0.249
1.70 1.91
0.356 0.483
0.330 0.457
0.191 0.241
0.152 0.203
5.283 BSC
8.001 BSC
5283 BSC
1.27 BSC
0.508 0.762
1.40 REF
0.25 BSC
8
0’
8’
5’
15’
0’
NOTES:
1. All dimensions are in both inches and millimeters.
2. Dimensioning and tolerancing per ASME Y 14.5M - 1994.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per
end. Dimension E1 does not include interlead flash or protrusion
interlead flash or protrusion shall not exceed 0.25mm per side.
D and E1 dimensions are determined at datum H.
4. The package top may be smaller than the package bottom. Dime-
-nsions D and E1 are determined at the outmost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash. But including any mismatch between the top and
bottom of the plastic body.
5. Datums A and B to be determined at datum H.
6. “N” is the maximum number of terminal positions for the specified
package length H.
7. The dimensions apply to the flat section of the lead between 0.10 to
0.25 mm from the lead tip.
8. Dimension “b” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10 mm total in excess of the “b” dimension
at maximum material condition. The dambar cannot not be located
on the lower radius of the lead foot.
9. This chamfer feature is optional. If it is not present, then a pin 1
idenfifier must be located within the index area indicated.
10.Lead coplanarity shall be within 0.10 mm. As measured from the
seating plane.
ES25P40
33
Rev. 0D May 11 , 2006