EMP107 Datasheet, PDF (3/4 Pages) Excelics Semiconductor, Inc. – 5.9 - 7.9 GHz Power Amplifier MMIC

UPDATED 05/08/2008
ASSEMBLY DRAWING
EMP107
5.9 – 7.9 GHz Power Amplifier MMIC
The length of RF wires should be as short as possible. Use at least two wires between RF pad and
50 ohm line and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 1130um X 2250um
Chip Thickness: 85 ± 15 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: [phone] Fax: [phone] Web: www.excelics.com
page 3 of 4
Revised May 2008