XR16M581 Datasheet, PDF (4/51 Pages) Exar Corporation – 1.62V TO 3.63V UART WITH 16-BYTE FIFO AND VLIO INTERFACE

XR16M581
1.62V TO 3.63V UART WITH 16-BYTE FIFO AND VLIO INTERFACE
Pin Description
REV. 1.0.1
NAME
CTS#
DTR#
DSR#
CD#
RI#
24-QFN
PIN#
32-QFN
PIN#
25-BGA
PIN#
TYPE
DESCRIPTION
18
24
A1
I _{UART Clear-to-Send (active low) or general purpose input. It can}
be used for auto CTS flow control, see EFR[7], MSR[4] and IER[7].
This input should be connected to VCC when not used.
-
22
B3
O _{UART Data-Terminal-Ready (active low) or general purpose output.}
-
25
C4
I _{UART Data-Set-Ready (active low) or general purpose input. This}
input should be connected to VCC when not used.
-
26
-
I _{UART Carrier-Detect (active low) or general purpose input. This}
input should be connected to VCC when not used.
-
27
-
I _{UART Ring-Indicator (active low) or general purpose input. This}
input should be connected to VCC when not used.
ANCILLARY SIGNALS
XTAL1
8
10
D5
XTAL2
9
11
C5
PwrSave
7
9
D4
RESET#
17
23
A2
VCC
GND
GND
19
28
B1
11
13
B5
Center Center
-
Pad
Pad
NC
13 2, 15-18
-
I _{Crystal or external clock input.}
O _{Crystal or buffered clock output.}
I _{Power-Save (active high). This feature isolates the M581’s data bus}
interface from the host preventing other bus activities that cause
higher power drain during sleep mode. See Sleep Mode with Auto
Wake-up and Power-Save Feature section for details. This pin does
not have an internal pull-down resistor. This input should be con-
nected to GND when not used.
O _{Device reset (active low). A 40 ns minimum LOW pulse on this pin}
will reset the internal registers and all outputs of the UART. The
UART transmitter output will be held HIGH, the receiver input will
be ignored and outputs are reset during reset period (see UART
Reset Conditions).
Pwr _{1.62V to 3.63V power supply.}
Pwr _{Power supply common, ground.}
Pwr _{The center pad on the backside of the QFN package is metallic and}
should be connected to GND on the PCB. The thermal pad size on
the PCB should be the approximate size of this center pad and
should be solder mask defined. The solder mask opening should be
at least 0.0025" inwards from the edge of the PCB thermal pad.
- _{No Connects.}
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
4