G4A01084C Datasheet, PDF (8/22 Pages) List of Unclassifed Manufacturers – MICROTEMP Thermal Cutoffs INTRODUCTION

Product Nomenclature
MICROTEMP^® TCO
G Z X XX TTTC
TTTC – Maximum
open temperature in °C
G – Rating type
(G – Global, Y – Non Agency, R – Regional)
Z – Internal construction
(4, 5, 6, 7, 8, 9)
XX – Modification of basic TCO
(Plating, lead material,
lead length, stenciling)
X – Case material and lead wire
(A, C, D, E, F)
MICROTEMP^® TCO Packages
G – Rating type
(G – Global, Y-Non Agency)
Z – Internal construction
(4, 5, 6, 7, 8, 9)
X – Case material and lead wire
(A, C, D, F)
G Z X X XX RR TTTC
TTTC – Maximum
open temperature in °C
RR – Assembly modifications
(Plating, terminal bend, stenciling)
XX – Specific package construction
(00-99)
X – General packages TCO type
(Configuration, potted, mounting base, etc.)
Figure 7
As shown in figure 7, Therm-O-Disc MICROTEMP^® TCOs follow a consistent product nomenclature that identifies the
basic product type, lead wire size, special features and packaging options. For example, a standard G4 series TCO
calibrated to open at 192°C would have a part number G4A00192C.
MICROTEMP^® TCO Product Markings
Primary TCOs
XXXXXXXX
MICROTEMP^®
P ZZZZZ
G Z X XX
T_F TTTC
Special customer identification
(when required, up to 9 characters)
Registered trademark
(P) Manufacturing plant;
(ZZZZZ) Date code
Part number (see figure 7)
( ) Underwriters Labs logo;
(T_F TTTC) Maximum open
temperature °C
Secondary Packages
XXXXXXXXX
MICROTEMP^®
G Z X X XX RR
T_F TTTC P ZZ
Special customer identification
(when required, up to 9 characters)
Registered trademark
(may be T-O-D)
Part number (see figure 7)
(T_F TTTC) Maximum open temperature °C;
(P) Manufacturing plant location;
(ZZ) Manufacture date code;
( ) Underwriters Labs logo
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