G4A01084C Datasheet, PDF (5/22 Pages) List of Unclassifed Manufacturers – MICROTEMP Thermal Cutoffs INTRODUCTION

Packaged Thermal Cutoffs
Therm-O-Disc also offers a variety of packaging options for MICROTEMP^® thermal cutoffs.
Therm-O-Disc offers two standard packages with wide application in the HVAC industry. Primarily
designed for heating applications, the GXAM04 and GXAM06 packages mount a standard G4 or
G5 TCO in a high temperature ceramic base (see figure 5).
The popular GXAP Potted TCO packages consist of a TCO epoxy-potted into a plastic insulating
mounting case. The assembly can be supplied with various case materials, shapes and terminations.
They can be used to accurately sense temperature as probes and as surface, airstream and ambient
sensors (see figure 6). They can be easily replaced in the field without disturbing the rest of the circuit.
Custom packages, insulations or special assemblies may be specified to meet specific unique
application needs. By taking advantage of our technical expertise and high volume production
methods and equipment, we can provide significant savings on custom packages.
Packaged TCO Material Specifications
Type
GXAP01
GXAP02
GXAP04
GXAP05
GXAP08
GXAP10
GXAP12
GXAM04
GXAM06
Base Material
Valox DR48
Ryton R-4
Valox DR48
Valox DR48
Ryton R-7
Ryton R-7
Valox DR48
Ceramic DIN VDE 0335, C 221
Ceramic DIN VDE 0335, C 221
Material Rating
Temperature °C
120
220
120
120
220
220
120
>250
>250
Maximum TCO
Temperature °C
128
152
128
128
184
184
128
240
240
GXAM06
GXAM04
Figure 5
GXAP04
GXAP08
GXAP12
GXAP02
Figure 6
GXAP05
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